REFLOW RE-700  
  Excellent thermal fluid for the fusion of the electrodeposited tin-lead alloy on the printed circuit boards. This modern formulation provides a superb thermal stability, is completely water soluble, non foaming, biodegrable and easily rinsable. It remains liquid at a temperature up to 5°C.  
     
  CLEANER CI-740  
  Printed circuit boards post-refusion decontaminant. Excellent thermal fluid for the fusion of the electrodeposited tin-lead alloy on the printed circuit boards. This modern formulation provides a superb thermal stability, is completely water soluble, non foaming, biodegrable and easily rinsable. It remains liquid at a temperature up to 5°C.  

 

     
  FLUXO HAL-720E  
  This is a highly stable fluxing fluid of to be used in the HASL-Hot Air Solder Leveling of printed circuits boards. It eliminates solder balling and webbing over the solder mask or base laminate, what makes it ideal for the single sided boards. It is water soluble and biodegradable and easily rinsable leaving a very brigth shinny clean solder surface.  
     
  FLUXO HAL-7509  
  Specially developed  for boards with SMD patterns. Other properties and characteristics are similar to the 720E.  
     
  FLUXO HAL-720  
 

Recommended for double face  boards with standard technology due to a low  operational cost. It is hydro soluble and biodegrable, providing a fine cleaning of the printed circuit boards, leaving the solder surface bright and clean.

FLUXO HAL-2000 (Volatile solvents free)

Developed to better serve the SMD pattern printed circuit boards. Volatile solvants free, therefore, it is inflammable. It is hydro soluble and biodegrable, providing a fine cleaning of the printed circuit boards, leaving the solder surface bright and clean.

  
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