DESENGRAXANTE CI 110  
 

It easily removes light oxidation and fingerprints, conditioning the resin on the hole wall, promoting a uniform deposition of copper. It works between 60 and 70 °C, in 4 to 6 minutes.

CONDICIONADOR ML-110 (for multilayers)
Used on multilayers boards electrolesss plating. Perfectely keeps the epoxy resin and the fiber glass, assuring a complete and uniform electroless plating on the hole wall  avoinding the rays of light entring during the back light test. It works between 60 and 70ºC, in 2 to 4 minutes.

  
     
  MICROETCH CI-120  
  Replaces the traditional sodium or ammonium persulphates eliminating inconveniences of uneven etching speed and processing time, low yield. It works between 20 and 30 °C, in 2 to 4 minutes.  
     
  PRECATALIZADOR CI-130  
  Stabilized saline acidic solution used as a pre-dip to the activation step to avoid contaminating and diluting the catalyst CI-140 due to drag out of rinsing water from previous treatment. It works between 20 and 30 °C, in 30 to 60 seconds.  
     
  CATALIZADOR CI-140  
  It is an activator or catalyst featuring a very high activity. Catalyst CI-140 assures a uniform and complete wall coating along time lot after lot, easily seen with the backlight test. It adheres on both, glass fibers and resin as well. copper adhesion is always more than satisfactory. It works between 20 and 30 °C, in 4 to 6 minutes.  
     
  POSCATALIZADOR CI-150  
  Avoids activator clusters being dragged into the electroless copper bath CI-160. Pos-catalyst CI-150 allows for an immediate and uniform electroless copper deposition. It works between 20 to 30 °C, in 2 to 3 minutes.

ACELERADOR ML-150 (for multilayers)
Combined with the CONDICIONADOR ML-110 provides a uniform and instantaneous start of the copper deposition.Used on multilayers boards electrolesss plating it assures a complete and uniform electroless plating on the hole wall avoinding the rays of light entring during the back light test. It works between 20 and 30 °C, in 2 to 3 minutes.
 
     
  COBREFLASH CI-160  
 

This an electroless copper plating bath to render the PCB holes conductive for the subsequent electrodeposition of the specified copper layer. Unlike most electroless formulations, the CI-160 is outstanding characteristics of simple operation, stability and control. One of the most versatile bath ever used in vertical processing lines, either with baskets or plating racks. It works between 20 and 25 °C, in 10 to 15 minutes.

  
 

COBRE RÁPIDO AV-160  (Cobre químico de velocidade)High stability without continuous filtering and it does not deposit on the tank hole wall. Reinforcing solution are very concentrated: it gives frequentless reinforce, more control, low freight and smallers stocks. It works between  35 and 40°C, and it deposits 2 microns in  30 minutes.

  
     
  COBRE RÁPIDO AV-161  
  High stability without continuous filtering and it does not deposit on the tank hole wall. Reinforcing solution are very concentrated: it gives frequentless reinforce, more control, low freight and smallers stocks. It works between  36 and 40°C, and it deposits 2 microns in  30 minutes.  
     
  ANTIOXIDANTE CI-170  
  It is a combination of organic components developed to inhibit copper oxidation for short or long time waiting time between operations or production steps. It works between 20 and 30 °C, in 30 to 60 seconds.  
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