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CLEANER
H-201 |
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Acid
deoxidizer and cleaner, developed specifically for cleaning
boards before copper strike electrodeposition providing a maximum
adhesion to the plated copper on the electroless copper. It
does not attack laminates, dry films or silk screened resists.
Quickly removes eventual oily residues as well as copper oxides
in very few minutes, leaving a very active copper surface easy
to rinse. It does not contain toxic chemicals and is biodegradable.
It works between 25 to 40 °C in 2 to 4 minutes.
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CLEANER
H-2000 |
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Acid
deoxidizer and cleaner recommended when a stronger action is
necessary. It does not contain toxic chemicals and is biodegradable.
It works at room temperature in 3 to 5 minutes. |
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DESOXIDANTE
650-OX
Degreaser and copper deoxidizer acid formulation
to be used on the Brown Oxidation with SEALBOND OMB.
Fast removal of the eventual greasy residues and oxidations.
Best for a perfect clean-up. Ecologically correct.
It works between 25 to 40°C, in 3 to 5 minutes. |
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DESENGRAXANTE
CI 110 |
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It
easily removes light oxidation and fingerprints, conditioning
the resin on the hole wall, promoting a uniform deposition of
copper. It works at 60 to 70 °C, in 4 to 6 minutes. |
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CONDICIONADOR
ML 110 |
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In
multilayer boards it easily removes light oxidation and fingerprints,
conditioning glass fibers and the resin on the hole wall, promoting
a uniform deposition of copper. It works at 60 to 70 °C, in
4 to 6 minutes. |
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DESENGRAXANTE
ML-210 |
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Removes
fingerprints and oily residues and eventual dry film residues
from the copper. It is used in the black oxide line. It works
at 40 to 50 °C, in 4 to 5 minutes. |
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