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CLEANER
ML-210 |
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Alkaline solution to clean and degrease a copper surface removing
eventual aqueous dry film residues. It works between 40 and
50 °C, in 4 to 5 minutes. |
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MICROETCH
CI-120 |
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Micro
etch for the copper surface leaving it ready for the black oxide
treatment. It replaces those traditional ammonium or sodium
persulphate etching solutions. It works between 20 and 30 °C,
in 1 to 3 minutes. |
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NEROX |
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Is
the traditional black oxide process. The oxide layer topography
promotes the adhesion of the prepregs or bonding layers in the
inner layers of multilayer printed circuit boards. It works
between 50 and 60 °C, in 5 to 10 minutes. |
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